UHV Sputtering offers a wide inventory of sputtering target materials. Process capability includes DC and RF magnetron sputtering. We process up to 12" diameter wafer as well as numerous other substrate materials. Our coatings are achieved under tight controls in a clean room environment, using completely refurbished, late model vacuum equipment.

Material and Sizes			Substrate Materials We Can Deposit On

Typical specifications			Others

Sputter Deposition Materials We Can Deposit

For more information, please contact our sales staff or submit an RFQ.