UHV Sputtering offers a high quality target bonding service as well as a wide range of sputtering materials. We specialize in bonding, employing state of the art Metalization Techniques. UHV utilize a variety of solder materials, which serve to interface the target and backing plate. These materials accommodate the various thermal and mechanical stresses that are characteristic in today’s sputtering equipment.

UHV custom tailors it’s bonds to meet each customers specific needs. For example, systems with high power density levels often require high temperature solder materials, while cathode designs with a severe mismatch in expansion rates achieve optimum performance with a more ductile material, such as indium.

Our materials consists of different sputtering target materials using the latest manufacturing methods, Hot Pressed, Sintured, Cold Isostatic Press, Hot Isostatic Press and sometimes a combination of these.

For more information, please contact our sales staff for more details or submit an RFQ.